Newshot
Account

Report: SK hynix Accelerates Equipment Investment to Further Expand HBM4 Capacity

Source: IT之家 Published: Business & Funding 中文 SKHBM4
AI summary

According to Korean media outlet Etnews, despite heightened AI industry uncertainty—including factors such as the CEO change at 英伟达—SK hynix still believes HBM (high-bandwidth memory) demand is strong. The company plans to focus investment on equipment for HBM packaging and testing, with formal use targeted for the first half of next year. According to multiple semiconductor equipment industry sources, SK hynix is discussing the purchase of HBM4 production equipment with partners, mainly coordinating procurement timing and quantities with equipment suppliers responsible for back-end processes such as HBM bonding, cutting, and inspection. A partner familiar with the matter said: “SK hynix is advancing additional investment in HBM4 production equipment and speeding up related arrangements, with the goal of completing equipment move-in and installation/commissioning in the first half of next year.” It is reported that SK hynix plans to accelerate its equipment investment schedule, with some equipment even requiring suppliers to complete delivery by the first quarter. Meanwhile, the new production base for this expansion may be selected at the P&T6 packaging and testing plant in Cheong

Translation(model translation, not the source's own text)

Report: SK hynix accelerates equipment investment schedule, further expands HBM4 capacity

Report: SK hynix accelerates equipment investment schedule, further expands HBM4 capacity

IT之家, November 15: According to a report by Korean media Etnews today, despite factors such as the CEO change at 英伟达 increasing uncertainty in the AI industry, SK hynix still believes demand for HBM (IT之家 note: high-bandwidth memory) remains strong. The company plans to focus investment on equipment for HBM packaging and testing, and plans to officially put it into use in the first half of next year.

SK hynix ships samples of 'world's first' 12-layer HBM4 product, mass production in 2H25: SK's 'all-in on AI' - EE Times Japan
SK hynix ships samples of 'world's first' 12-layer HBM4 product, mass production in 2H25: SK's 'all-in on AI' - EE Times Japan

According to multiple semiconductor equipment industry sources, SK hynix is discussing the procurement of HBM4 production equipment with partners. The company is mainly coordinating purchase timing and quantities with equipment suppliers responsible for back-end processes such as HBM bonding, cutting, and inspection.

A SK hynix partner familiar with the matter said: "SK hynix is pushing forward additional investment in HBM4 production equipment and accelerating related arrangements, with the goal of completing equipment move-in and installation and commissioning in the first half of next year." It is learned that SK hynix plans to accelerate the equipment investment schedule, and for some equipment, suppliers are even required to complete delivery before the first quarter.

Meanwhile, the additional production base for SK hynix's capacity expansion may be selected at the P&T6 packaging and testing plant in Cheongju, North Chungcheong Province, South Korea. This semiconductor plant was formerly called M8 and was selected by SK hynix in 2025 as an HBM production base. Since the beginning of this year, SK hynix has been building HBM production lines there.

Another industry insider said: "SK hynix plans to use the idle space at the P&T6 plant as much as possible to expand HBM4 capacity. If the entire plant operates at full capacity, it can additionally produce more than 20,000 HBM wafers per month."

At its third-quarter earnings briefing last month, SK hynix said: "Through 2029, the company's DRAM and HBM capacity for the next three years has in effect been completely sold out."

Related articles

  • Report: SK hynix's HBM4 yield has exceeded 70%, competing with Samsung and Micron in the next-generation memory market
  • Counterpoint: Global DRAM revenue in Q3 approaches $200 billion, surging 369% year over year to achieve a super cycle
  • SK hynix CEO 郭鲁正: DRAM and HBM memory capacity through 2029 is almost sold out
  • Quarterly profit hits a record, SK hynix launches a $75 billion shareholder return plan
  • SK hynix reports net profit attributable to shareholders of 173.68 trillion won for the first three quarters of fiscal 2026, up 527% year over year
  • Reportedly, Samsung Electronics and SK hynix will fully mass-produce and ship 8Hi HBM4 memory to 英伟达 in 2027Q2

The translation is machine-generated and individual terms may be off. Nothing is rewritten or cut; the original is authoritative.

Published by IT之家
This site only summarises and aggregates; copyright stays with the original author. Headlines and summaries follow the source — where they differ, the original wins.
Read the original ↗