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New Unigroup and BAIC Group Set Up Joint Innovation Center, Cooperating on SoC Chips, Smart Cockpits and More

Source: IT之家 Published: Business & Funding 中文 SoC 2 more articles on this event →
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On November 12, New Unigroup and BAIC Group held an unveiling and deepened-cooperation signing ceremony for their joint innovation center in Beijing, deepening cooperation in key areas such as SoC chips, cockpit-driving domain control, smart cockpits and smart chassis domain control. New Unigroup Chairman 李滨 and BAIC Group Party Secretary and Chairman 张建勇 jointly unveiled the "BAIC Group × New Unigroup Joint Innovation Center." At the ceremony, Unigroup's Tongxin and BAIC Group's BAIC Research Institute signed a strategic cooperation agreement to jointly develop advanced automotive-grade process cockpit-driving integrated SoC chips, with the two sides to jointly build system-level solutions for smart vehicles and accelerate the large-scale application of domestic automotive chips.

Translation(model translation, not the source's own text)

New Unisplendour Group and BAIC Group Establish Joint Innovation Center, Cooperating on SoC Chips, Smart Cockpits, and More

IT Home, November 13 — On November 12, New Unisplendour Group and BAIC Group held a plaque-unveiling and deepened-cooperation signing ceremony for their joint innovation center in Beijing. The two parties will deepen cooperation in key areas such as SoC chips, cockpit-driving domain control, smart cockpits, and smart chassis domain control, driving the deep integration of automotive chip R&D with vehicle applications.

李滨, Chairman of New Unisplendour Group, and 张建勇, Party Secretary and Chairman of BAIC Group, jointly unveiled the "BAIC Group × New Unisplendour Group Joint Innovation Center."

At the signing ceremony, Unigroup Tongxin, a subsidiary of New Unisplendour Group, and BAIC Research Institute, a subsidiary of BAIC Group, signed a strategic cooperation agreement to carry out joint R&D on cockpit-driving integrated SoC chips based on advanced automotive-grade processes. IT Home has learned that the two parties will jointly build system-level solutions for smart vehicles and accelerate the application and implementation of related technologies and products in vehicle scenarios.

The two parties stated that they will further leverage their respective advantages, accelerate the implementation of key cooperation projects, promote the large-scale application of domestically produced automotive chips, and jointly advance the high-quality development of the smart vehicle industry.

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