Newshot
Account

JD unveils semiconductor industry's first smart logistics solution, achieving 100% full automation from wafer line-off to packaging

AI summary

IT Home, Nov 13: The 23rd China International Semiconductor Exhibition (IC China 2026) opened yesterday (the 12th) at the China National Convention Center in Beijing. JD Logistics exhibited and proposed the semiconductor industry's first smart logistics solution, which can achieve 100% unmanned operation across the warehousing, sorting, outbound and packaging of semiconductor materials, marking a shift of logistics for high-value precision materials from single-point automation to system-level unmanned operation. JD Logistics has for the first time connected a 100% fully automated chain from finished wafer line-off to packaging: after fabrication in the cleanroom (FAB), finished wafers are sealed in aluminum foil and picked into storage by cleanroom robots; before storage, AI vision algorithms verify the packaging again to ensure there is no risk of air leakage; "Zhilang" aerial robots and transfer robots work together to quickly complete warehousing, sorting and outbound; and the wafers are finally packed automatically on conveyor belts, with outbound records retained for 5–10 years — after one semiconductor company adopted the 100% fully unmanned solution, storage density rose 21

Translation(model translation, not the source's own text)
  • Day/Night Follow system Light Dark

Finished wafers achieve 100% full automation from off-line to packaging, JD Logistics launches the semiconductor industry's first intelligent logistics solution

IT之家 November 13 news: The 23rd China International Semiconductor Expo IC China 2026 opened yesterday (the 12th) at the China National Convention Center in Beijing.

JD Logistics exhibited and proposed the semiconductor industry's first intelligent logistics solution, which can achieve 100% unmanned operations in the warehousing, sorting, outbound, and packaging stages of semiconductor materials, marking the move of high-value precision material logistics from single-point automation to system-level unmanned operations.

According to the official introduction, semiconductors are in an expansion cycle driven by demand for AI computing power and automotive electronics, and logistics efficiency directly affects capacity release. The industry has extremely strict requirements for stability and safety: a single finished wafer can be worth up to US$500,000 (IT之家 note: approximately RMB 3.343 million at current exchange rates), and a single warehouse can store tens of thousands of items, worth up to billions of US dollars; storage conditions are demanding, requiring high cleanliness and constant temperature and humidity; once mis-shipped, it would face huge time and economic losses, and batches and expiry dates need long-term traceability. Past manual operations were not only labor-intensive but also prone to wrong picking and missed picking.

JD Logistics has for the first time connected a 100% fully automated chain for finished wafers from off-line to packaging: after finished wafers are completed in the cleanroom (FAB), they are sealed with aluminum foil and picked up and put into storage by cleanroom robots; before storage, AI vision algorithms will verify the packaging again to ensure no risk of air leakage; the “智狼” flying-ladder robot and handling robots work together to quickly complete inbound, sorting, and outbound; finally, they are automatically packed via conveyor belt, and outbound records can be retained for 5–10 years.

According to the introduction, after a certain semiconductor company adopted the 100% full-process unmanned solution, storage density increased by 210%, inventory accuracy reached 100%, and operating efficiency increased by 300%; more can be stored in the same area, batch locations can be queried in real time, and the inbound/outbound rhythm has significantly accelerated.

Related articles

  • TrendForce: In Q2 2026, the total output value of the top ten wafer foundries reached nearly US$53.49 billion, hitting a new high
  • Cerebras unveils CS-6 wafer-scale evolution: disruptive 3D stacking, first vertical integration of DRAM
  • SEMI data: global silicon wafer shipments in 2026Q2 grew 7.4% year on year and 9.1% quarter on quarter
  • Responding to strike risk: reports say Samsung is reducing new wafer starts and shifting capacity to high-value memory such as HBM
  • Intel details yield improvement: chip binning evolves after more than 40 years, reducing wafer edge variation to increase output
  • SEMI: 12-inch wafer fab equipment spending will continue to grow over the next four years, exceeding RMB 1 trillion for the first time next year

软媒 websites: IT之家 最会买 - rebates, cashback, and coupons iPhone之家 Win7之家 Win10之家 Win11之家

软媒 software: 软媒 mobile app 魔方 最会买 要知

The translation is machine-generated and individual terms may be off. Nothing is rewritten or cut; the original is authoritative.

Published by IT之家
This site only summarises and aggregates; copyright stays with the original author. Headlines and summaries follow the source — where they differ, the original wins.
Read the original ↗