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Report: SK Hynix HBM4 Yield Has Surpassed 70%, Competing with Samsung and Micron in the Next-Generation Memory Market
IT Home, November 12 news: According to a report by Chosun Biz today, SK Hynix's HBM4 memory yield has exceeded 70%, and competition with Samsung and Micron will become more intense.
The report says SK Hynix's production yield for sixth-generation high-bandwidth memory (HBM4) has risen above 70%. Because HBM4 is harder to manufacture than previous products, securing early output is seen as a key variable determining mass-production competitiveness. However, SK Hynix has not yet officially announced yield figures.
HBM4 is next-generation high-bandwidth memory that vertically stacks multiple DRAM chips to improve data processing speed and bandwidth. Unlike standard DRAM, HBM goes through multiple steps from manufacturing individual chips to stacking, packaging and final testing. The lower the production yield, the more production resources are needed, which raises manufacturing costs.
The report notes that industry observers value the figure of over 70%: on the same calculation basis, raising yield from 60% to 70% can increase the number of sellable units obtained from the same production input by about 16.7%. However, in actual production, product performance, manufacturing cost and customer demand must be weighed.
On the third-quarter earnings call on October 28, SK Hynix said HBM4 yields in both front-end and back-end processes are among the best in the industry. The company said HBM4 yield exceeded its initial plan, prompting it to raise internal targets.
IT Home notes that Samsung Electronics and Micron are also stepping up promotion of HBM4. In September this year, market views held that Samsung Electronics' HBM4 yield had risen to about 80%. For SK Hynix, which holds an advantage in the HBM3E market, maintaining competitiveness in next-generation products requires not only performance but also production yield and capacity.
The report says the industry believes that initial mass-production yield and stable supply capability for HBM4 will become key factors shaping future market share.
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