ChangXin DDR5 update: 32Gb dies enter production, MRDIMM speeds reach up to 12800Mbps

ChangXin DDR5 Product Progress: 32Gb Dies Land, MRDIMM Speeds Up to 12800Mbps

IT Home, November 12 news: Lanjing Tech learned from ChangXin about the latest progress of its DDR5 RDIMM and MRDIMM product lines.

• DDR5 dies have completed the iteration from 24Gb to 32Gb

• RDIMM modules achieve full coverage of mainstream capacities from 32GB to 128GB and speeds from 5600Mbps to 8000Mbps

• MRDIMM covers 128GB and 192GB capacities, with maximum speeds up to 12800Mbps

IT Home note: RDIMM refers to Registered Dual Inline Memory Module, mainly targeting servers and data centers; MRDIMM refers to Multiplexed Rank Dual Inline Memory Module, a new generation of ultra-high-bandwidth memory for AI large-model training/inference and high-performance computing.

ChangXin Technology Vice President 骆晓东 said today that memory demand has entered a "tiered era," with demand diverging across different market segments. Currently, the server market accounts for more than 50% of demand, and demand for high-end storage and high-performance chips in the server market is rising.

ChangXin Technology said that driven by demand from the rapid development of AI applications, the company continued to receive strong demand for products from server customers in the fourth quarter. The DRAM supply shortage is expected to continue, and the company's fourth-quarter revenue is expected to maintain its growth trend.

Further reading: The 24Gb and 32Gb mentioned in the article refer to the capacity of a single DRAM chip (die), in units of gigabits. 32Gb means a single die has a capacity of 32 gigabits (about 4GB). The larger the die capacity, the fewer dies need to be stacked for the same module capacity. The main differences between MRDIMM (multiplexed memory module) and RDIMM lie in architecture and performance. RDIMM buffers control signals through a built-in register to stabilize the memory system and support larger capacities; MRDIMM uses multiple memory ranks within a single module, leveraging MRCD (Multiplexed Register Clock Driver) and MDB (Multiplexed Data Buffer) components to access dual-rank memory simultaneously, thereby greatly increasing bandwidth and reducing the load on the memory controller. DDR5 MRDIMM uses a standard 287-pin design and is compatible with DDR5 RDIMM slots, enabling performance upgrades on existing platforms without changing the system architecture. It mainly targets scenarios with high memory capacity and bandwidth requirements, such as high-performance computing, large-scale databases, virtualization, real-time analytics, and AI/machine learning.

Further Reading

The 24Gb and 32Gb mentioned in the article refer to the capacity of a single DRAM chip (die), in units of gigabits. 32Gb means a single die has a capacity of 32 gigabits (about 4GB). The larger the die capacity, the fewer dies need to be stacked for the same module capacity.

The main differences between MRDIMM (multiplexed memory module) and RDIMM lie in architecture and performance. RDIMM buffers control signals through a built-in register to stabilize the memory system and support larger capacities; MRDIMM uses multiple memory ranks within a single module, leveraging MRCD (Multiplexed Register Clock Driver) and MDB (Multiplexed Data Buffer) components to access dual-rank memory simultaneously, thereby greatly increasing bandwidth and reducing the load on the memory controller.

DDR5 MRDIMM uses a standard 287-pin design and is compatible with DDR5 RDIMM slots, enabling performance upgrades on existing platforms without changing the system architecture. It mainly targets scenarios with high memory capacity and bandwidth requirements, such as high-performance computing, large-scale databases, virtualization, real-time analytics, and AI/machine learning.

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